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  Datasheet File OCR Text:
 CPA241
MICROTECHNOLOGY
ABSOLUTE MAXIMUM RATINGS
SUPPLY VOLTAGE, +VS to -VS OUTPUT CURRENT, continuous INPUT VOLTAGE, differential INPUT VOLTAGE, common mode TEMPERATURE, junction
350V 60mA 16V VS 150C
NOTE:
Refer to parent product data sheet PA241 for typical AC electrical characteristics, precautions, applications and other test parameters.
DC WAFER PROBED SPECIFICATIONS
PARAMETER OFFSET VOLTAGE, initial BIAS CURRENT, initial COMMON MODE REJECTION VOLTAGE SWING SUPPLY CURRENT, quiescent TESTCONDITIONS1 VS = 50V VCM = 90 V DC IO = 40mA VS = 50 V 84 VS-12 1.8 MIN TYP 15 56 94 VS-10 2.1 MAX 40 200 2.3 UNITS mV pA dB V mA
NOTES: 1. 2.
Unless otherwise stated VS = 50 V, TA = 25C, DC input specification value given. Sample tested by wafer to 95%.
TYPICAL EXTERNAL CONNECTIONS
DIE LAYOUT
* Required component and value if given. Optional balance components are recommended values. CC is NPO, rated for full supply voltage -VS to +VS. NOTE: Diagram for connection illustration only. All op amp configurations are possible. Pad 1 2 3 4 Function Output Compensation Compensation Current Limit Pad 5 6 8 9 Function +Vs -Vs +IN -IN
Dimension: 154.5 x 117.5 2.5 Mils. Thickness: 15 Mil (380). Backside Metal: None, Silicon. Bond pad: 5 Mil sq (127) AI. Make no connection to bond pads not listed by function. Note: The backside of the CPA241 die is isolated up to 500V. The top side walls of the CPA241 die are isolated up to 300V. Ordering Information: Order #: CPA241DI80: Die are only available in waffle packages with a total of 80 die per package.
CAUTION
The CPA241 is a MOSFET amplifier. ESD handling procedures must be observed
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible ORDERS (520) 690-8601 * EMAIL prodlit@apexmicrotech.com APEX MICROTECHNOLOGY CORPORATION * TELEPHONE (520) 690-8600 * FAX (520) 888-3329 * inaccuracies or omissions. All specifications are subject to change without notice. CPA241 REV B OCTOBER 2006 (c) 2006 Apex Microtechnology Corp.
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